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스크린 인쇄용 Offset 인쇄용 잉크젯 인쇄용 디스펜싱용 New Material

Copper-Silver Nano Paste

製品概要

  • 導電性銅ペーストは、銅ナノ粒子を極性溶媒に高固形分で分散させて、製造します。当製品は、既存の高価の銀ペーストを代替し、より経済的に印刷工程に応用が可能です。

製品特徴

  • 低費用のダイレクトプリント工程で微細線幅に応用可能
  • プラスチックやガラス基板に優秀な密着性
  • 多様な焼成条件に応用可能

製品仕様

Properties Specification Remark
Solid contents 85 ±5 wt% -
Viscosity (0.4rpm) 90,000~120,000 cp Brookfield HB spindle #51
Shelf time 3 months (refrigerated) Stir in the paste before using
Specific Resistivity 1~6×10-5Ω.cm (Air)
6~9×10-6Ω.cm(Nitrogen)
@200~250℃
Substrate Bare glass, Plastic film, ITO glass  
Printing method Screen printing, Offset  


XRD-data of Copper-silver core shell nano particles

    XRD-data of Copper-silver core shell nano particles


XRD image for Cu-Ag core shell nanoparticles

    XRD image for Cu-Ag core shell nanoparticles


TEM image for Cu-Ag core shell nanoparticles

    TEM image for Cu-Ag core shell nanoparticles


Silver Nano Wire

製品仕様

Properties Specification Sample
Solid contents 0.2~0.5wt% Silver Nano Wire
Solvent DIW, IPA
Diameter 35±5nm
Length 10~30um



ANP AgNW TEM

    ANP AgNW TEM


ANP AgNW SEM

    ANP AgNW SEM


ANP AgNW Transmittance

    ANP AgNW Transmittance