Material of CMP Slurry
Metal oxide
Product Introduction
- CeO2 nano powder is evenly dispersed in solution and can be applied for the chemical mechanical planarization process.
- Several grades of CeO2 powder by different primary particle size
- Primary particle size of CeO2 Powder
Product Specification
| Silicon Oxide Scratch Properties |
| Scratch size |
0.4∼0.5 |
0.5∼1.0 |
1.0∼28 |
S/C |
Total |
| ANP |
0.26 |
0.17 |
0.17 |
0.67 |
0.19 |
| Competitor |
1.0 |
1.0 |
1.0 |
1.0 |
1.0 |
Product Application
- It can be applied for the chemical and mechanical planarization process in semi-conduct industry.
