Material of CMP Slurry

Metal oxide

Product Introduction

• CeO₂ nano powder is evenly dispersed in solution and can be applied for the chemical mechanical planarization process.
• Several grades of CeO₂ powder by different primary particle size
• Primary particle size of CeO₂ Powder

Product Specification

Silicon Oxide Scratch Properties
Scratch size	0.4∼0.5	0.5∼1.0	1.0∼28	S/C	Total
ANP	0.26	0.17	0.17	0.67	0.19
Competitor	1.0	1.0	1.0	1.0	1.0

Product Application

• It can be applied for the chemical and mechanical planarization process in semi-conduct industry.