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Material of CMP Slurry

Product Introduction

  • CeO2 nano powder is evenly dispersed in solution and can be applied for the chemical mechanical planarization process.
  • Several grades of CeO2 powder by different primary particle size
  • Primary particle size of CeO2 Powder



Product Specification



Silicon Oxide Scratch Properties
Scratch size 0.4∼0.5 0.5∼1.0 1.0∼28 S/C Total
ANP 0.26 0.17 0.17 0.67 0.19
Competitor 1.0 1.0 1.0 1.0 1.0


Product Application

  • It can be applied for the chemical and mechanical planarization process in semi-conduct industry.